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Laser Comms
Advancing space-based laser communications with safer and faster data transmission
As the need for critical data gathering increases, there is a greater demand for securely moving information at high speeds. Heavily regulated RF links are now stressed beyond capacity, and involve large beams that are easily jammed and intercepted.
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RAD750®
The 3U Compact CI Single-Board Computer (SBC)
The 3U CompactPCI® single-board computer (SBC) employs the RAD750® 200M microprocessor, the latest radiation-hardened version of the IBM PowerPC® 750 microprocessor.
RAD5545™
Multi-Core System-On-Chip Power Architecture® Processor
The RAD5545 multi-core processor is a highly integrated solution with an order of magnitude leap in performance for emerging on-board processing applications.
RAD510™
3U Compact PCI single-board computer
The 3U CompactPCI® single-board computer (SBC) employs the RAD510 System on a Chip (SoC) featuring a radiation-hardened RAD5500® Processor Core, built on Power Architecture®.
SPACEWIRE
SpaceWire is a spacecraft communication network coordinated by the European Space Agency, and used in some NASA spacecraft.
Developed through a partnership with NASA, SpaceWire interface chips will be used on the Geostationary Operational Environmental Satellite and Lunar Reconnaissance Orbiter missions.
PRODUCT GUIDE
Radiation-hardened electronics product guide
Technology center for radiation-hardened Table of Contents and high-reliability electronics
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11,500
5545™ multi-core system-on-chip Power Architecture® processor
The RAD5545 multi-core processor is a highly integrated solution with an order of magnitude leap in performance for emerging on-board processing applications. The RAD5545 system-on-chip (SoC) microprocessor offers a balanced combination of three capabilities – Power Architecture processors for portability of heritage software, large memory capacity powered by dual interleaved DDR2/3 DRAM memory interfaces, and high I/O throughput based on serializer/deserializer (SerDes) high-speed links. The RAD5545 SoC microprocessor singlehandedly replaces multiple cards of previous generations with four RAD5500™ 32/64-bit Power Architecture processor cores, three levels of on-die cache, four RapidIO® (SRIO) ports, and a 16-port SpaceWire router.
Key features and benefits
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Disclaimer and copyright BAE Systems reserves the right to restrict component sales based on application and volume. Please contact the factory for more information. This document gives only a general description of the product(s) and service(s) and, except where expressly provided otherwise, shall not form any part of any contract. From time to time, changes may be made in the products or the conditions of supply.
Reduced size, weight, and power based on the QorlQ® architecture enables support of various applications Processor throughput of up to 5.6 giga operations per second (GOPS)/ 3.7 GFLOPS and memory bandwidth of up to 102 Gb/s and I/O throughput of up to 64 Gb/s enables superior efficiency Designed for insertion into the SpaceVPX standard, supporting the RapidIO data plane, SpaceWire control plane, and inter-integrated circuit (I2C) utility plane 16-port router supports space-specific SpaceWire serial protocol 64-bit core increases performance, supporting direct addressability to 64GB of memory, improving double precision floating pointperformance, and achieving 3.0 MIPS/Mhz per core (12 per SoC) Multiple levels of cache memory minimizes access to main memory, maximizing effective throughput Trust architecture infrastructure provides secure boot, integrity code testing, data encryption, and partitioningof the system to prevent unauthorized access tomemory locations, enabling secure operation 32-bit parallel peripheral component interconnects (PCI) interface enables legacy connections Four serial RapidIO ports implement efficient handlingof Rapid IO message and streaming data packets Data Path Acceleration Architecture (DPAA) offloadsfunctions from processor cores to further theireffectiveness
Laser communications in space
As the need for critical data gathering increases, there is a greater demand for securely moving information at high speeds. Heavily regulated RF links are now stressed beyond capacity, and involve large beams that are easily jammed and intercepted. From cross-links, to space/ground links, to deep space relays, free space laser communications provide multi-gigabit per second data transfer that is significantly more robust against unwanted interference. This innovative technology will enable great leaps in space exploration. Through the transmission of high resolution data and images from outer space and back to earth, we have the ability to study other planets in the same detail we currently study our own. With this received information, We are then able to create a virtual presence in the solar system, and in turn support interplanetary storm tracking and in-depth environment analysis. In particular, the speed afforded to us through laser-based communications will permit the study of a live feed of the Mars surface while utilizing less space and power than traditional RF communications.
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Optical performance empowers secure, high data rate (10Mbps-100 Gbps) communications for various space missions Software-defined modem enables flexibility and configurability Low size and mass which is optimal for hosted and dedicated payload missions. High reliability components ensure a long mission life System versatility enables the support of multiple applications including geostationary orbit crosslinks, geostationary orbit or low-earth orbit downlinks, and deep space relays
RAD750®3U CompactPCI single-board computer
The 3U CompactPCI® single-board computer (SBC) employs the RAD750® 200M microprocessor, the latest radiation-hardened version of the IBM PowerPC® 750 microprocessor. This is teamed with an enhancedpower PCI bridge ASIC and 1 GB of EDAC protected SDRAM to provide a high performance PCI version 2.2 backplane bus-compatible SBC.
Key features
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RAD750 3U flexible architecture
RAD750® family of products:
RAD750® radiation-hardened PowerPC microprocessor RAD750® 3U CompactPCI single-board computers RAD750® 6U CompactPCI single-board computers RAD750® space computers SIMICS virtual platform RAD750® 6U custom single-board computers EMC 3U CompactPCI standalone I/O controllers
Example startup ROM and Wind River VxWorks board support package provided for all hardware configurations Green Hills Software’s INTEGRITY real-time operating system can serve as an alternate-board support package Hardware reference manuals and software user guide provided All compilers currently available for the commercial RAD750® Power PC microprocessor are fully compatible with the RAD750® Operating systems for PowerPC® 750-based computers are easily ported to RAD750® computers VxWorks and INTEGRITY operating systems are available WindRiver offers a RAD750® SIMICS simulator Compiler, assembler, linker, and simulator are available for embedded microcontroller in the Power PCI Bridge ASIC SBC qualification complete and TRL 9
SpaceWire Rad Hard ASIC and Evaluation Board
SpaceWire is a spacecraft communication network coordinated by the European Space Agency, and used in some NASA spacecraft. BAE Systems is the first company to produce a chip that is fully compliant to SpaceWire standards. SpaceWire radiation-hardened single-chip interface performs the functions of multiple chips at a fraction of the size while saving cost, space, weight, and power. Developed through a partnership with NASA, SpaceWire interface chips will be used on the Geostationary Operational Environmental Satellite and Lunar Reconnaissance Orbiter missions. By integrating multiple functions, this single-chip solution eliminates the need for an additional bus for command and control by enabling the reliable transport of SpaceWire high-speed serial links. The chip is radiation-hardened to 200 krad(Si) total dose, measures less than 1E-9 upsets/bit-day SEU, and is latchup-immune.
Four SpaceWire ports and two peripheral component interconnect busses, connected by a six-port router A multi-gigabyte memory interface supported by a direct-memory access controller An embedded microcontroller usable for packet-processing or standalone operation Additionally, BAE Systems has created a SpaceWire evaluation board. The 6U 160 CompactPCI evaluation board represents a first generation SpaceWire solution This cost-effective prototyping board uses the custom SpaceWire application-specific integrated circuit to implement a four-port SpaceWire card with onboard memory. It provides complete router capability among the four ports, along with two user-end-point ports
RAD510™ 3U CompactPCI Single-board computer
The 3U CompactPCI® single-board computer (SBC) employs the RAD510 System on a Chip (SoC) featuring a radiation-hardened RAD5500® Processor Core, built on Power Architecture®. The RAD510 SBC is a modern alternative to the RAD750® SBC product line, delivering the performance of a single core RAD5545® SoC at lower power than a RAD750 SBC. The RAD510 SoC delivers state-of-the-art radiation-hardened processing via a high performance PCI version 2.2 backplane bus-compatible SBC in a 3U profile.
RAD510 3U flexible architecture
RAD510 family of products:
RAD510 3U CompactPCI single-board computers
RAD5500 processor core operating frequency ranges from 66MHz to 462MHz, supporting both low power and high performance applications for enhanced versatility Non-volatile and volatile memory protects and maintains data in the most demanding environments 32 programmable inputs, outputs, and interrupts provide customers with the flexibility to optimize their mission needs Port SpaceWire router supports high transmission speeds of data, up to 330Mb/s on each link With integrated hamming code, the SoC can correct and detect errors within its 512KB of L2 cache.
Single-board computer products
Over 1,000 BAE Systems processors on more than 300 satellites with over 10,000 years of space operation
• RAD5500 processor core operating frequency ranges from 66MHz to 462MHz, supporting both low power and high performance applications for enhanced versatility. • Non-volatile and volatile memory protects and maintains data in the most demanding environments. • 32 programmable inputs, outputs, and interrupts provide customers with the flexibility to optimize their mission needs. • 4-port SpaceWire router supports high transmission speeds of data, up to 330Mb/s on each link. • With integrated hamming code, the SoC can correct and detect errors within its 512KB of L2 cache.
RAD750® 3U single-board computers
RAD750® 6U single-board computers
RAD5545® single-board computers
RAD5545® support products
Daughtercards
ASIC technologies
High density, optimized power and performance
ASIC technology
ASIC design tools
IP cores
Standard components
Reliable, radiation-hardened, space-qualified, hermetically-sealed, and military-screened components
Memory
Microprocessors*
ASSP interface components
ASSP interface components 2
Power converters
BAE Systems is a global defense, security, and aerospace company, delivering a full range of products and services for air, land, and naval forces, as well as advanced electronics, information technology solutions, and customer support services.The company develops and produces a wide array of radiation-hardened space products, from standard components and single-board computers, to complete system payloads. BAE Systems specializes in a broad domain of radiation-hardened electronics, including application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), microprocessors, memories, Field Programmable Gate Arrays (FPGAs), and single-board computers. With more than 1,000 computers in space, including the 16-bit GVSC1750, the 32-bit RAD6000® CPU, and the RAD750® family of products, BAE Systems’ space computers have logged over 10,000 years in orbit. The Space Products and Processing group in Manassas, Virginia has been providing products and system-level solutions to the commercial, military, and space communities since the early 1980s. Our latest family of Power Architecture® computer products, based on a radiation-hardened version of the 32/64-bit e5500 processor core, includes single-core and multi-core based single board computers, such as the RAD5545® SBC.
Overview
BAE Systems offers a wide range of wirebond and flip-chip hermetic packages to support space, military, avionics, and commercial ASICs and memories. These include families of ceramic quad flat packs, ceramic column grid arrays, plastic ball grid arrays with glob-top, and stacked and unstacked die in multichip modules.
Packaging
BAE Systems’ space test facility provides logic and memory testers for components and flying probe and card testers for circuit card assemblies. The facility has full environmental testing capability for both components and cards, including a J.L. Shepherd Cobalt-60 Gamma source for on-site total-dose testing at military-standard (MIL-STD) dose rates and a thermal vacuum chamber for card test. Failure analysis instruments include photoemission and scanning electron microscopes, and focused-ion beam systems that support process diagnostics and semiconductor repair. Electrical test equipment includes the Advantest V93000 smart scale System-on-chip (SoC) test system with 1024 signals installed and a capacity of up to 4000 signal pins. Speeds as high as 8 Gbps are available.BAE Systems also has extensive experience developing and performing tests at linear accelerator, flash X-ray, heavy-ion, proton and neutron test facilities
Testing
Quality
The BAE Systems Manassas and foundry partner fabrication facilities are included in the Defense Logistics Agency (DLA) Qualified Manufacturer List (QML) for production of avionics and radiation-hardened space parts. Qualification under the Department of Defense (DoD)QML program involves a rigorous validation process by a panel of government agencies and customers. Qualified manufacturers understand user requirements and technical processes to produce and constantly improve high-quality, reliable integrated circuits and modules. BAE Systems’ space product portfolio is certified and qualified to DLA performance specifications MIL-PRF-38535 and MIL-STD-883 for QML Class V and Q, including Radiation Hardness Assurance (RHA) and support for legacy requirements.The facility is accredited as a DoD category 1A trusted source aggregator, covering design, test, packaging, and assembly services. The accreditation expresses the Defense Department’s confidence in BAE Systems’ ability to deliver trusted microelectronics equipment and services to U.S. government end users.
Product select
The 3U CompactPCI® single-board computer (SBC)
multi-core system-on-chip Power Architecture® processor
RAD510
3U CompactPCI Single-board computer
